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Die Brush & Foam Pad for Wafer-Thin Dies

SIZZIX

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  • $17.50


Sizzix-Die Brush Tool. Designed to instantly remove leftover paper from chemically-etched dies, wafer-thin dies and cut out designs. The sleek, ergonomic rubber-grip handle allows for non-slip and easy maneuverability as it smoothly rolls away excess paper. This package contains 5-1/2x1-3/4x1-1/4 inch die brush tool and one 7x4- 1/2x1/2 inch foam pad.

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